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 The next generation metrology tool The TOF.SIMS 300 R has an industrial design dedicated to the demands of the semiconductor industry. Its recipes include trace metal detection with detection limits down to 108 atoms/cm2, detection of organic surface contaminants, high performance depth profiling, dosimetry of implants, and characterization of sub-micrometer structures and defects. The TOF.SIMS 300 R provides clean room compatible, automated 300 mm wafer handling, analysis and data reduction with high stability and performance. With the 300 mm high-precision four-axes sample stage a new level of sample navigation has been reached. A linear travel speed of 20 mm/s and full wafer repeatability of less than 1 µm allow fast and accurate sample positioning on the full 300 mm wafer. The advanced design of the transfer system guarantees clean and fast 200 mm and 300 mm wafer handling. The layout with mini-environment, robot chamber with wafer storage and pre-aligner, and TOF-SIMS metrology module provides an optimum configuration for high sample throughput and excellent vacuum conditions.  Go to Information Request for details. |
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High vacuum robot chamber with loadlock, wafer storage and pre-aligner.
Fully automated system operation and data evaluation.
FOUP loadport with class 1 mini-environment.
Optional loadlock system for the introduction of standards and small wafer pieces.
High performance TOF-SIMS metrology module.